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Home > News > Industry News > Infineon to enter packaged sil.....

Infineon to enter packaged silicon microphone market

  • Author:Ella Cai
  • Release on:2017-07-25
Infineon will  enter the packaged silicon microphone market with samples of  high performance, low noise MEMS microphones in Q4. Volume production starts in Q1 2018..

The analogue and digital microphones are based on Infineon’s dual backplate MEMS technology with a 70 dB signal-to-noise ratio (SNR) and a  distortion level of 10% at a 135 dB sound pressure level (SPL).

In a 4 mm x 3 mm x 1.2 mm MEMS package, the microphones are  suitable for  acoustic recordings and far field voice capturing applications.

“This is an expansion of the established high volume bare die MEMS and ASIC business model with our packaging partners around the world,” says Infineon’s Dr. Roland Helm,  “we will continue to strengthen and grow our business with our partners with bare dies; additionally we now address low noise high-end use cases with our two new packaged microphones.”

Current MEMS microphone technology uses a sound wave actuated membrane and a static backplate. Infineon’s dual backplate MEMS technology uses a membrane embedded within two backplates thus generating a truly differential signal.

This allows improved high frequency immunity for better audio signal processing and increases the acoustic overload point of 10 p%  Total Harmonic Distortion (THD) to 135 dB SPL.

The SNR of 70 dB is an improvement of 6 dB compared to a conventional MEMS microphone. This improvement is equivalent to doubling the distance from which a user can give a voice command that is captured by the microphone.

Additionally, the analogue and digital microphones have microphone-to-microphone matching with ±1 dB sensitivity matching and ± 2° phase matching which makes them suitable for implementing in arrays and applicable to  ultra-precise beam forming and noise cancelling.