Contact us
Company: Excellent Integrated System Limited
Contact person: Ella Cai
Address: RM 2501 JIEJIA BUILDING FUTIAN SHENZHEN 518031,CHINA
Email: sales009@eis-ic.com / sales009@eis-limited.com
Skype: sales009-EIS
Phone: 0086-755-23611101
Fax: 0086-755-61679009-109
Contact Now
Home > News > Industry News > 63rd IEDM promises variety

63rd IEDM promises variety

  • Author:Ella Cai
  • Release on:2017-10-18
The 63rd IEDM to be held December 2-6, 2017 at the San Francisco Hilton promises to be a memorable IEDM for its variety.

Among the talks are presentations by Intel and Globalfoundries, which will each detail their forthcoming competing FinFET transistor technology platforms in a session on Wednesday morning.

“Those who attend IEDM 2017 will find much that is familiar, beginning with a technical program describing breakthroughs in areas ranging from mainstream CMOS technology to innovative nanoelectronics to medical devices. The Sunday Short Courses are also a perennial favorite because they are not only comprehensive but are also taught by accomplished world experts,” says Dr. Barbara De Salvo, Scientific Director at Leti.

“But we have added some new features this year. One is a fourth Plenary session, on Wednesday morning, featuring Nobel winner Hiroshi Amano. Another is a revamped Tuesday evening panel. Not only will it focus on a topic of great interest to many people, it is designed to be more open and less formal to facilitate audience participation.”

Other features of the IEDM 2017 include:
• Focus Sessions on the following topics: 3D Integration and Packaging; Modeling Challenges for Neuromorphic Computing; Nanosensors for Disease Diagnostics; and Silicon Photonics: Current Status and Perspectives.
• A vendor exhibition will be held, based on the success of last year’s event at the IEDM.
• The IEEE Magnetics Society will again host a joint poster session on MRAM (magnetic RAM) in the exhibit area. New for this year, though, is that the Society will also hold its annual MRAM Global Innovation Forum on Thursday, Dec. 7 at the same hotel, enabling IEDM attendees to participate. (Refer to the IEEE Magnetics Society website.) The forum consists of invited talks by leading experts and a panel discussion.

Here are details of some of the events that will take place at this year’s IEDM:

90-Minute Tutorials – Saturday, Dec. 2

These tutorials on emerging technologies will be presented by leading technical experts in each area, with the goal of bridging the gap between textbook-level knowledge and cutting-edge current research.
• The Evolution of Logic Transistors Toward Low Power and High Performance IoT Applications, Dr. Dae Won Ha, Samsung Electronics
• Negative Capacitance Transistors, Prof. Sayeef Salahuddin, UC Berkeley
• Fundamental, Thermal, and Energy Limits of PCM and ReRAM, Prof. Eric Pop, Stanford University
• Hardware Opportunities in Cognitive Computing: Near- and Far-Term, Dr. Geoffrey Burr, Principal Research Staff Member, IBM Research-Almaden
• 2.5D Interposers and High-Density Fanout Packaging as Enablers for Future Systems Integration, Dr. Venkatesh Sundaram, Associate Director, Georgia Tech 3D Systems Packaging Research Center
• Silicon Photonics for Next-Generation Optical Interconnects, Dr. Joris Van Campenhout, Program Director Optical I/O, Imec

Short Courses – Sunday, Dec. 3

The day-long Short Courses provide the opportunity to learn about important developments in key areas, and they enable attendees to network with the industry’s leading technologists.

Plenary Presentations – Monday, Dec. 4
• Driving the Future of High-Performance Computing, Lisa Su, President & CEO, AMD
• Energy-Efficient Computing and Sensing: From Silicon to the Cloud, Adrian Ionescu, Professor, EPFL
• System Scaling Innovation for Intelligent Ubiquitous Computing, Jack Sun, VP of R&D, TSMC
Plenary Presentation – Wednesday, Dec. 6
• Development of a Sustainable Smart Society by Transformative Electronics, Hiroshi Amano, Professor, Nagoya University. Dr. Amano received the 2014 Nobel Prize in Physics along with Isamu Akasaki and Shuji Nakamura for the invention of efficient blue LEDs, which sparked a revolution in innovative, energy-saving lighting. His talk will be preceded by the Focus Session on silicon photonics.
Evening Panel Session – Tuesday evening, Dec. 5
• Where will the Next Intel be Headquartered?  Moderator: Prof. Philip Wong, Stanford

Entrepreneurs Lunch

Jointly sponsored by IEDM and IEEE EDS Women in Engineering, this year’s Entrepreneurs Lunch will feature Courtney Gras, Executive Director for Launch League, a local nonprofit focused on developing a strong startup ecosystem in Ohio.

The moderator will be Prof. Leda Lunardi from North Carolina State University. Gras is an engineer by training and an entrepreneur by nature.

After leaving her job as a NASA power systems engineer to work for on own startup company, she discovered a passion for building startup communities and helping technology-focused companies meet their goals. Named to the Forbes ‘30 Under 30’ list in 2016, among many other recognitions and awards, Gras enjoys sharing her stories of founding a cleantech company with young entrepreneurs.

She speaks on entrepreneurship, women in technology and clean energy at venues such as TEDx Budapest, the Pioneers Festival, and the IEEE WIE International Women’s Leadership Conference.

Among notable papers are:

Macronix will discuss an ultra-high-density 3D NAND technology. (Paper 19.1)

Nobel Prize winner Hiroshi Amano will speak on ‘Transformative Electronics’ at the Wednesday Plenary session.

IBM’s Dan Edelstein will give a retrospective on copper interconnect and discuss its prospects. IBM’s introduction of copper interconnect was transformative for the semiconductor industry, and has been a major factor in its ability to keep pace with Moore’s Law. (Paper 14.1)

The first functional circuit built with stacked silicon nanowire transistors, from Imec and Applied Materials (Paper 37.4)

A 14nm ferroelectric FinFET technology from Globalfoundries, for high-performance, low-power applications (Paper 15.1)

A sweat-sensor-based “Laboratory on the Skin” from Switzerland’s EPFL. (Paper 18.1)

Four novel implantable microfluidic devices for a variety of diseases/chronic conditions, from Houston Methodist Research Institute and Italy’s Politecnico di Torino. (Paper 10.1)

Four Focus Sessions with invited papers from world experts on the topics of 3D Integration and Packaging, Modeling Challenges for Neuromorphic Computing, Nanosensors for Disease Diagnostics, and Silicon Photonics.

A poster session on MRAM memory, an emerging non-volatile memory technology that is attractive because of its size, speed and low-power requirements, and which is in the process of commercialization. The poster session is sponsored by the IEEE Magnetics Society.