DARPA to invest $1.5bn in IC R&D
- 作者：Ella Cai
- 发布时间：：2018-07-25
DARPA, the US Defense Department’s Defense Advanced Research Projects Agency is to work with research teams from industry and academia under DARPA’s $1.5 billion Electronics Research Initiative (ERI) to boost long-term semiconductor research.
The partnerships will target advances in semiconductor circuit design, materials, and systems architectures.
ERI is divided into three main research thrust areas – Design, Materials & Integration, and Architectures.
Each thrust area will feature two new research programs. The Design research thrust area will include the Intelligent Design of Electronic Assets (IDEA) program and the Posh Open Source Hardware (POSH) program.
The Materials & Integration research thrust area will include the Three-Dimensional Monolithic System-on-a-Chip (3DSoC) program and the Foundations Required for Novel Compute (FRANC) program.
The ERI Architectures research thrust area will include the Software Defined Hardware (SDH) program and the Domain-specific System on Chip (DSSoC) program.
“The semiconductor industry plows about one-fifth of its revenues into R&D – among the highest shares of any sector – and has a long record of partnering with our government to advance early-stage research,” says SIA CEO John Neuffer, “the new DARPA research partnerships mark a major commitment to furthering semiconductor technology and keeping America at the tip of the spear globally in semiconductor innovation.”
Neuffer also noted SIA’s longstanding support for basic scientific research funded through other federal agencies such as the National Science Foundation (NSF), the National Institute of Standards and Technology (NIST), and the Department of Energy (DOE) Office of Science.
He expressed the semiconductor industry’s eagerness to work with the Administration and Congress to advance research investments that will promote America’s economic and national security and technological leadership.
In total, the ERI will invest upwards of $1.5 billion over five years to jumpstart innovation in the electronics industry.
The partnerships will target advances in semiconductor circuit design, materials, and systems architectures.
ERI is divided into three main research thrust areas – Design, Materials & Integration, and Architectures.
Each thrust area will feature two new research programs. The Design research thrust area will include the Intelligent Design of Electronic Assets (IDEA) program and the Posh Open Source Hardware (POSH) program.
The Materials & Integration research thrust area will include the Three-Dimensional Monolithic System-on-a-Chip (3DSoC) program and the Foundations Required for Novel Compute (FRANC) program.
The ERI Architectures research thrust area will include the Software Defined Hardware (SDH) program and the Domain-specific System on Chip (DSSoC) program.
“The semiconductor industry plows about one-fifth of its revenues into R&D – among the highest shares of any sector – and has a long record of partnering with our government to advance early-stage research,” says SIA CEO John Neuffer, “the new DARPA research partnerships mark a major commitment to furthering semiconductor technology and keeping America at the tip of the spear globally in semiconductor innovation.”
Neuffer also noted SIA’s longstanding support for basic scientific research funded through other federal agencies such as the National Science Foundation (NSF), the National Institute of Standards and Technology (NIST), and the Department of Energy (DOE) Office of Science.
He expressed the semiconductor industry’s eagerness to work with the Administration and Congress to advance research investments that will promote America’s economic and national security and technological leadership.
In total, the ERI will invest upwards of $1.5 billion over five years to jumpstart innovation in the electronics industry.
